LUO Weiguo,GAN Weixing,ZHOU Tianshen,et al.Influence of Cu2+ Pretreatment on the Corrosion Resistance of Electroless Plated Nickel-Phosphorus Film[J].Plating & Finishing,2021,(9):25-30.[doi:10.3969/j.issn.1001-3849.2021.09.005]
Cu2+处理对化学镀Ni-P镀层抗腐蚀性能的影响
- Title:
- Influence of Cu2+ Pretreatment on the Corrosion Resistance of Electroless Plated Nickel-Phosphorus Film
- 文献标志码:
- A
- 摘要:
- 本文研究了化学镀前处理过程中铜离子对铝基表面化学镀镍磷（Ni-P）层的结构和质量的影响。采用扫描电子显微镜对浸锌过程中锌层以及化学镀Ni-P层的表面形貌进行了表征，并采用电化学阻抗谱与塔菲尔曲线对Ni-P层电化学抗腐蚀性能进行了分析。实验结果表明，Cu2+处理提高了Ni-P层的表面平整性并改善了锌层中锌颗粒的大小以及分布的均匀性，表面平整和结构致密的化学镀层也使Ni-P层在3.5 wt.% NaCl溶液中的抗腐蚀性能得到极大提高。
- Abstract:
- The influence of Cu2+ pretreatment on the structure and properties of Ni-P films was studied. The surface morphology of zinc films and Ni-P films were characterized by the scanning electron microscopy （SEM） while the corrosion resistance of Ni-P films were analyzed by the electrochemical impedance spectroscopy （EIS） and Tafel curves. The results show that the Cu2+ pretreatment can improve the uniformity of Ni-P films and modify the uniformity of the size and distribution of the zinc particles. The corrosion resistance of Ni-P film in 3.5 wt.% NaCl solution can be also enhanced after Cu2+ pretreatment, which may be mainly due to the smooth surface and dense structure of Ni-P films.
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备注/Memo
收稿日期： 2020-11-07；修回日期： 2020-12-08
作者简介： 骆纬国（1996—），男，硕士研究生，email：luoweiguo@sjtu.edu.cn
通信作者： 杭弢，email：hangtao@sjtu.edu.cn