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[1]彭娟,杜学铭,刘生发,等.IGBT铜焊盘化学镀Ni-Fe-P的制备及耐蚀性研究[J].电镀与精饰,2022,(4):11-15.[doi:10.3969/j.issn.1001-3849.2022.04.003]
　PENG Juan,DU Xuemin,LIU Shengfa,et al.Preparation and Corrosion Resistance of Electroless Ni-Fe-P Coating on IGBT Copper Pads[J].Plating & Finishing,2022,(4):11-15.[doi:10.3969/j.issn.1001-3849.2022.04.003]

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IGBT铜焊盘化学镀Ni-Fe-P的制备及耐蚀性研究

《电镀与精饰》[ISSN:1001-3849/CN:12-1096/TG] 卷: 期数: 2022年4 页码: 11-15 栏目: 出版日期: 2022-04-15

Title:: Preparation and Corrosion Resistance of Electroless Ni-Fe-P Coating on IGBT Copper Pads

作者:: 彭娟¹; 杜学铭¹; 刘生发¹; 刘俐¹; 2*; (1.武汉理工大学材料学院，湖北武汉 430070；2.华中科技大学材料成形与模具技术国家重点实验室，湖北武汉430074)

Author(s):: PENG Juan¹; DU Xuemin ¹ ; LIU Shengfa ¹ ; LIU Li ^{1 2*}; ( 1.School of Materials Science and Engineering Wuhan University of Technology Wuhan 430070 China 2.State Key Laboratory of Materials Processing and Die & Mould Technology Huazhong University of Science and Technology Wuhan 430074 China )

关键词:: 化学镀; Ni-Fe-P 镀层; 正交试验; 耐腐蚀性能; 工艺参数优化

Keywords:: electroless plating Ni-Fe-P coating orthogonal experiments corrosion resistance optimal parameters

分类号:: TQ174.4

DOI:: 10.3969/j.issn.1001-3849.2022.04.003

文献标志码:: A

摘要:: 针对 IGBT 模块中铜焊盘的腐蚀问题，采用化学镀方法在铜基板表面制备了 Ni-Fe-P 镀层。设计正交试验研究了镀液温度、 pH 、 Fe²⁺ /Ni ²⁺ 摩尔比对镀层成分的影响，并通过电化学腐蚀实验分析镀层的耐腐蚀性能。结果表明，对于镀层中的 Fe 、 P 含量，影响因素的主次顺序均为： pH 值、温度、 Fe²⁺ /Ni ²⁺ 摩尔比。不同成分的 Ni-Fe-P 镀层均能有效地保护铜基板不被腐蚀，且镀层中 Fe 含量越高，镀层的耐腐蚀性能越好。

Abstract:: ： Aiming at the corrosion problem of the copper pads in the IGBT module ， Ni-Fe-P coating was prepared on copper substrates by electroless plating. The influences of bath temperature ， pH ， and Fe 2+ /Ni 2+ molar ratio on the composition of the coating were studied by orthogonal experiments ， and the corrosion resistance of the coating was analyzed through electrochemical corrosion experiments. The results showed that the sequence of influencing factors for the content of Fe and P in the coating was pH value ， plating temperature and Fe 2+ /Ni 2+ molar ratio. The Ni-Fe-P coatings of different compositions could effectively protect the copper substrate from corrosion ， and the coatings showed better corrosion resistance with the Fe content increasing.

参考文献/References:

[1] Salahinejad E, Eslami F R, Tayrbi L. Synergistic galvanic-pitting corrosion of copper electrical pads treated with electroless nicle-phosphorus/immersion gold surface finish[J]. Engineering Failure Analysis, 2017, (77): 138-145.

[2] Tseng T H, Wu A T. Corrosion on automobile printed circuit brode[J]. Microelectronics Reliability, 2019, (98): 19-23.

[3] Maura C, Andrea S, Bernhard E, et al. The corrosion resistance of electroless deposited nano-crystalline Ni-P alloy[J]. Electrochimica Acta, 2008, 53(8): 3364-3370.

[4] Salahinejad E, Eslami Farsani R, Tayebi, L. Synergistic galvanic-pitting corrosion of copper electrical pads treated with electroless nickel-phosphorus/immersion gold surface finish[J]. Engineering Failure Analysis, 2017(77): 138-145.

[5] Liu L, Zhang H, Zheng H, et al. Influence of crystalline structure on diffusion barrier property of electroless Ni-Fe-P coatings in Zn-Al solder interconnects[J]. Journal of Alloys and Compounds, 2019, (804): 42-48.

[6] Zhou H F, Guo J D, Zhu Q S, et al. Application of electroless Fe-Ni film for under-bump metallization on solder joint[J]. Jour nal of Materials Science & Technology, 2013, 29(1): 7-12.

[7] Zhou H F, Guo J D, Shang J K. Electroless deposition of highly solderable Fe-Ni films[J]. Journal of the Electrochemical Society, 2013, 160(6): 233-239.

[8] Wang S L. Studies of electroless plating of Ni-Fe-P alloys and the influences of some deposition parameters on the properties of the deposits[J]. Surface and Coatings Technology, 2004, 186(3): 372-376.

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备注/Memo

收稿日期： 2020-01-21 修回日期： 2020-03-18 作者简介：彭娟（ 1995 —），女，硕士， email ： 1125821576@qq.com * 通信作者：刘俐， email ： l.liu@whut.edu.cn 基金项目：湖北省自然科学基金（ 2018CFB212 ），华中科技大学材料成形与模具技术国家重点实验室开放资金（ P2018-018 ）

更新日期/Last Update: 2022-04-20